DuPont FilmTec™ SG30-400/34i RO Membrane Element (8" x 40")
The FilmTec™ SG30-400/34i (Part Number: 272569) by DuPont Water Solutions is a semiconductor-grade reverse osmosis (RO) membrane element engineered specifically for ultrapure water (UPW) polishing applications in high-precision microelectronics and pharmaceutical manufacturing. Designed to meet stringent water purity requirements, it delivers high organic compound rejection, exceptional silica and boron removal, and an accelerated TOC rinse down profile.
Featuring an active surface area of 400 ft² (37 m²) and an integrated 34-mil feed spacer, the SG30-400/34i minimizes pressure drop and fouling impact, extending run times between chemical cleanings. Built-in iLEC™ Interlocking End Caps simplify installation without lubricants, reducing o-ring leak risks and particle generation to safeguard system purity.
Key Technical Specifications
| Feature / Metric | Specification |
|---|---|
| Part Number | 272569 |
| Active Area | 400 ft² (37 m²) |
| Permeate Flow Rate | 10,200 gpd (38.6 m³/d) @ 225 psi |
| Stabilized Salt Rejection | 99.5% (NaCl) |
| Membrane Type | Polyamide Thin-Film Composite |
| Feed Spacer Thickness | 34 mil |
| Dimensions (L × Dia.) | 40.0 in × 7.9 in (1,016 mm × 201 mm) |
| Max Operating Pressure | 600 psig (41 bar) |
| Max Operating Temp | 113°F (45°C) |
| Sanitization Temp Limit | 185°F (85°C) @ 25 psig |
| pH Range (Continuous) | 2 – 11 |
Primary Benefits & Applications
- High Organic & Silica Removal: Optimizes UPW polishing performance by efficiently rejecting low-molecular-weight organic species (e.g., Isopropanol, Acetone) and dissolved silica.
- Accelerated TOC Rinse Down: Reaches strict ultrapure water quality standards rapidly during initial startup or maintenance cycles.
- Reliable iLEC™ Technology: Eliminates the need for external lubricants, preventing chemical contamination and physical O-ring wear.
- Fouling-Resistant Spacer: The 34-mil feed spacer improves hydraulic flow, reducing pressure loss across the vessel and increasing cleaning efficiency.
- Ideal Industry Uses: Microelectronics, semiconductor fabrication, and pharmaceutical UPW polishing systems.
